Integrated Circuits (ICs)

Microprocessors, Microcontrollers, ASICs, FPGAs, SoCs

ListedTaiwan

Combination of ultra-thin high-density silicon capacitors and power supply network (BSPDN) on the ba

Semiconductors and Electronics

This invention combines Ultra-Thin High-Density Silicon Capacitors (UTHDSC) with a Backside Power Supply Network (BSPDN) specifically for the 2nm semicondu…

Potential of the applicationNot provided

Application No.

M668047

Patent No.

TWM668047U

Status

Issued

Polo View Patent →

ListedTaiwan

Combination of Ultra-Thin High-Density Silicon Capacitors and Fan-out Packaging Glass Substrate

Semiconductors and Electronics

This innovation combines Ultra-Thin High-Density Silicon Capacitors (UTHDSCs) with fan-out packaging glass substrates to enhance electrical performance. By…

Potential of the applicationNot provided

Application No.

M669584

Patent No.

TWM669584U

Status

Issued

Polo View Patent →

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Price

Combination of ultra-thin high-density silicon capacitors and power supply network (BSPDN) on the ba

Combination of Ultra-Thin High-Density Silicon Capacitors and Fan-out Packaging Glass Substrate